P481 – 6″ HV sputter deposition HZDR
Application
HV sputter deposition system for thin film and multilayer deposition at 6″ substrates
Year of delivery
2021
Installation site
HZDR, Dresden-Rossendorf, Germany
Design Features
- HV magnetron sputter deposition system in face to face sputter down configuration.
- Up to three 8″ magnetrons in face to face configuration with possibility of low pressure and low power sputtering.
- Motorized sample manipulator with three motion axes (z translation, manipulator arm rotation & sample planetary rotation).
- Integrated bake out system.
- Load lock chamber with storage.
Special Features
- Different sample sizes from 6″ wafer down to 100mm x 100mm samples can be handled (using different kind of sample adapters).
Outer Dimensions
Technical specifications and performance values
General
Sputtering chamber
Size
1000 mm diameter, about 650 mm height
Material
stainless steel
Load lock chamber
Size
350 mm diameter, about 1050 mm height
Material
stainless steel
Vacuum
Sputtering chamber
Base pressure
< 2 *10-8 mbar
Pump down time
3 hours to < 9 * 10-8 mbar
Chamber pumping
Turbo pumping stage, chamber lid differentially pumped by dry foreline pump
Bake out
< 120°C
Load lock chamber
Base pressure
< 9 * 10-8 mbar
Pump down time
3 hours to < 9 * 10-8 mbar (without samples installed)
16 hours to < 9 * 10-8 mbar (with 20 samples installed)
Chamber pumping
Turbo pumping stage with dry foreline pump
Manipulator features
Sputtering chamber
Sample size
diameter max. 6″ substrate
Motion axes
3 motorized axes (manipulator z tranlsation, (continous) manipulator arm rotation and (continous, planetary) sample stage rotation)
Special features
Motorized source shutter (open / close synchronised with sample rotation)
Load lock chamber
(Sample storage)
Storage size
20 sample holders
Sample size
diameter max. 6″ substrate
Motion axes
motorized z tranlsation and motorized transfer rod
Performance test results
Chamber pump down
Deposition uniformity (face to face, ferromagnetic)
Giant magnetoresistance (GMR) effect
Deposition uniformity (face to face, non ferromagn.)
